The Global OCP EMEA Summit is a platform where global technology leaders gather to address issues related to data center sustainability, energy efficiency, and thermal reuse in the region. The focus is on exploring how innovations from hyperscale data center operators can help overcome these challenges. The Global OCP EMEA Summit also highlights the deployment of specific OCP-recognized data center equipment in the EMEA region.

The Global OCP EMEA Summit targets global data center operators, hardware manufacturers, cloud service providers, and the open-source community, promoting the implementation of an open hardware ecosystem in the EMEA region.

The OCP Future Technology Workshop will once again focus on the sustainability of data centers and innovations that typically occur within five years, ensuring long-term challenges are addressed and ensuring that researchers, academia, and startups become part of the OCP ecosystem. In addition to a full exhibition hall showcasing the latest innovations, the Innovation Village will host technical demonstrations where participants can experience these solutions firsthand.

Main Constituents: Engineers (24%), Sales & Business (15%), Executives (10%), Technical Architects & Product Managers (each 9%). Geographic Distribution: North America (77%), Asia Pacific (17%), Europe/Middle East/Africa (5%).

The Global OCP EMEA Summit attracted 142 exhibitors this year, an increase of approximately 30% compared to last year. Apart from manufacturers from North America and Taiwan, there were also Chinese mainland companies participating. Overall, Chinese manufacturers mainly focused on high-performance servers and optical communications, signaling their active participation in the international open computing ecosystem.

Open Computing Hardware Design‌: Including open hardware reference designs that comply with OCP standards such as servers, storage devices, network equipment, etc.

‌Power & Cooling Systems‌: Such as high-efficiency power architectures, liquid cooling technology, AI-optimized thermal management solutions

‌AI & High-Performance Computing Infrastructure‌: For example, Arm AGI CPU dual-node reference server, AI accelerators, OCP-compatible AI cluster architecture

‌Data Center Modularization & Edge Computing‌: Covering new deployment forms such as OCP DC-MHS (Data Center Modular Hardware Standard)

‌Open Firmware & System Management Tools‌: Including diagnostic frameworks, debugging tools, system verification platforms, etc.

‌Sustainable Data Center Technologies‌: Energy-efficient design, carbon footprint optimization, green energy integration, etc., which are in line with OCP's sustainable development goals.